原板夹杂引起的镀锡板表面缺陷分析  

ANALYSIS OF DEFECT ON TINPLATE SURFACE

作　　者：季思凯[1] 王林[1] 

机构地区：[1]宝钢股份有限公司

出　　处：《物理测试》2003年第5期30-34,共5页Physics Examination and Testing

摘　　要：应用场发射扫描电镜(FE-SEM)和光学显微镜观察研究了各种典型的镀锡板表面缺陷的宏观和微观 形貌特征,并通过能谱仪对缺陷成分进行了定性分析,结果表明原板夹杂引起了镀锡板表面缺陷,同时定义了 镀锡板表面缺陷类型及其表现形式。Various typical defects in tinplate surface was observed by using cold field emission scan electron microscope (FE-SEM) and energy dispersive spectrum (EDS) and microscope, The compositions of the defect were analyzed qualitatively. It is resulted that various defects in tinplate surface was ascribed to the inclusions in black plate, and defined the types of the defects in tinplate surface.

关 键 词：镀锡板 镀锡原板 表面缺陷 原板夹杂 场发射扫描电镜 

分 类 号：TB484.4[一般工业技术—包装工程]