场致扩散焊接界面结合质量的超声无损评价  

Bonding Quality Evaluation for Interface of Field-Assisted Diffusion Bonding by Ultrasonic Nondestructive Method

作　　者：曹宗杰[1] 王久洪[1] 薛锦[1] 王裕文[1] 

机构地区：[1]西安交通大学材料科学与工程学院,西安710049

出　　处：《西安交通大学学报》2003年第11期1163-1166,共4页Journal of Xi'an Jiaotong University

摘　　要：采用超声C扫描成像方法得到β-Al2O3陶瓷与纯铝的场致扩散焊接界面C扫描图像,用直方图最大熵值法对C扫描图像进行二值化处理,由二值化图像计算该界面的焊合率.通过研究不同工艺参数条件下试样的焊合率与剪切强度的关系,发现焊合率与剪切强度近似成线性关系,剪切强度随着焊合率的升高而升高,由此证明焊合率是反映界面结合质量的重要参数.用此方法对不同工艺参数条件下K4玻璃和纯铝的场致扩散焊接界面结合质量进行评价,发现焊接温度和外加电场电压的升高提高了试样的焊合率,改善了场致扩散焊接界面的结合质量.研究结果表明,超声C扫描方法适用于场致扩散焊接界面结合质量的评价,为场致扩散焊接,特别是低强度脆性材料的场致扩散焊接界面结合质量的评价提供了一种新方法.The C-scan image of the interface between β-Al2O3 ceramic and aluminum bonded by field-assisted diffusion bonding was obtained by ultrasonic C-scan imaging method and binarized by histogram maximum entropy method. The bonded ratio of the interface, which was calculated from the C-scan image, linearly increases with the increase in the shearing strength of the samples. It is proved that bonded ratio is an important parameter to evaluate the bonding quality. The bonding qualities of the interfaces between K4 glass and aluminum bonded by field-assisted diffusion bonding were evaluated by this method. It shows that the increase in the voltage of electric field and bonding temperature results in an increase in the bonded ratio and so improves the bonding quality. The result indicates that the investigated method is efficient for the quality evaluation of the interface of field-assisted diffusion bonding, particularly the bonding of brittle materials with low strength.

关 键 词：场致扩散焊接 超声无损检测 焊合率 

分 类 号：TG441.7[金属学及工艺—焊接]