微型机械技术和应用前景  

Micro-Mechanism Technology and Its Application Prospect

作　　者：潘洋宇[1] 李迎[1] 王拴虎[1] 

机构地区：[1]南京理工大学,江苏南京210094

出　　处：《兵工自动化》2003年第5期12-14,共3页Ordnance Industry Automation

摘　　要：微型机械具有体形超小,受热胀、噪声和挠曲等影响甚微,高速工作稳定,能耗低,惯性小,谐振频率高,响应时间短,无延迟,节约材料、成本低等特点,可用蚀刻工艺制作,适宜大批量生产。已列入国家863计划并发展到微米级。以单晶硅侵蚀技术为基础的硅整体微机械加工,和以多晶硅剥落技术的表面微机械加工,是典型的微型机械技术。克服离心力、微细噪声等是应注重解决的问题。Micro mechanism has a super little shape and characteristics of least influence from factors such as heat swell, noise and wind, working stably at high speed,low energy waste, little inertia, high resonance frequency, short response time, no delay, saving materials and low costs. It can be manufactured with etching process and is fit to produce in large batch. It was arrayed in the State Project 863, and developed up to millimeter grade. The whole micro machine manufacturing of silicon based on single crystal silicon and surface micro machine manufacturing based on peeling technology of multi Crystals Silicon are typical of micro mechanism technologies. However, overcoming centrifugal force and micro-noises, etc. are the problems to be resolved.

关 键 词：微型机械技术 加工技术 应用前景 发展现状 蚀刻工艺 半导体 

分 类 号：TN305[电子电信—物理电子学]