脉冲参数对氨基磺酸盐镀镍择优取向的影响  

Effects of Pulse Parameters on Preferred Orientation of Ni Electroplating from Sulphamate Bath

作　　者：王庆富[1] 张鹏程[1] 周晋林[1] 王晓红[1] 张延志[1] 王嘉勇[1] 

机构地区：[1]中国工程物理研究院,四川绵阳621900

出　　处：《材料保护》2003年第11期18-20,共3页Materials Protection

摘　　要：　采用脉冲电镀在氨基磺酸盐镀液中以相同的平均电流密度不同脉冲导通/间歇时间制备镍镀层,用X射线衍射仪(XRD)研究了镀层结构及脉冲参数对镀层择优取向的影响。结果表明,所有镍镀层皆为面心立方结构,在(200)面有明显择优取向;脉冲间歇时间(toff)为9ms时,(200)面的相对取向密度(J200)随脉冲导通时间(ton)的增加而减小;ton为0.1ms时,J200随toff的增加而增大;当脉冲峰值电流密度(ip)大于19A/dm2时,J200随ip的增大而增大;(200)面择优取向密度受过电位、镍离子的还原速度和氢氧化镍在阴极表面吸附的共同作用。Nickel electroplating was prepared from sulphamate bath with pulse plating technology at a constant average current density and different pulse on/off time, and the structure of plating and the effects of pulse parameters on preferred orientation of electroplating were studied by Xray diffractometer (XRD). The results indicated that all the crystallographic structures of nickel coatings were face centered cubic and had a highly preferred orientation of (200) face. At an offtime of 9 ms, the relative orientation density J200 of (200) face decreased with the increase of ontime. At an ontime of 0.1 ms, J200 increased with the increase of offtime. When the pulse peak current density ip was greater than 19 A/dm2, J200 increased with the accretion of ip. The preferred orientation density of (200) face depended on the combined effect of over potential, reduction rate of nickel ion and absorption of nickel hydroxide on the cathodic surface.

关 键 词：镍 脉冲电镀 择优取向 氨基磺酸镍镀液 X射线衍射 

分 类 号：TQ153.1[化学工程—电化学工业]