Cu/Ag_(20)复合材料的性能研究  

Investigation of A New Cu/Ag_(20) Composite

作　　者：李宏 熊易芬[2] 卢峰[2] 王健[2] 郑福前[2] 管伟明[2] 

机构地区：[1]有研亿金新材料股份有限公司,北京100088 [2]昆明贵金属研究所,云南昆明650221

出　　处：《贵金属》2003年第4期44-48,共5页Precious Metals

摘　　要：采用一种新颖、独特的方法制备了新型Cu/Ag2 0 复合材料。当对数变形率 η =1 0 5 6时 ,电导率为 95 79%IACS ,极限抗拉强度达 71 0MPa。考察了热处理时间和温度对材料性能和结构的影响 ,分析了材料的加工方法、宏观性能与微观结构的关系。材料的性能与其界面密切相关。因此 ,对材料界面进行金相和电子探针分析 ,并绘制了不同温度下以Cu/Ag2 0 界面反应产物 (Ag +Cu)含量 (重量百分比 ,下同 )为表征参数的界面反应动力学曲线 ,解释了相应的材料宏观性能的变化 ,指出了这种复合材料的非平衡材料本质。A kind of Cu/Ag laminar composite material containing 20wt%Ag was prepared using a unique and novel technique.Its mechanical and electrical properties were measured.The optimized Cu/Ag 20 laminar composite with a true strain of η=10.56 showed an ultimate tensile strength (UTS) of 710 MPa and electrical conductivity of 95.79% IACS at room temperature.Its microstructural characteristics were observed under the optical metallographic microscopy (OM) and electron probe (EPMA-1600).There exists a close relationship between the properties and Cu/Ag interface in the composite.Therefore,the Cu/Ag interface dynamical curves symbolized by the content of (Ag+Cu) were drawn at various temperatures.The effect of heat treatment temperature and time on mechanical and electrical properties of Cu/Ag 20 composite materials were investigated.The paper brough to light essential characteristic of this kind of imbalance materials.

关 键 词：Cu/Ag20复合材料 强度 电导率 界面 性能 

分 类 号：TB331[一般工业技术—材料科学与工程]