纯铜双辉等离子体渗镍层形成及扩散机理分析  

Diffusion Mechanism and Formation of Nickelized Layer by Double Glow Discharge Process on Copper Surface

作　　者：袁庆龙[1] 池承忠[1] 苏永安[1] 徐重[1] 

机构地区：[1]太原理工大学表面工程研究所,山西太原030024

出　　处：《金属热处理》2003年第11期43-45,共3页Heat Treatment of Metals

摘　　要：采用双层辉光离子渗金属技术实现了在纯铜表面的渗镍 ,对渗层中镍元素的分布进行了测定 ,用扩散偶方法计算了铜镍等温互扩散系数 ,并对在辉光放电中影响扩散系数的因素进行了讨论。结果表明 ,纯铜双层辉光离子渗镍是一个先吸附沉积再扩散的过程 ,利用扩散偶方法求得的等温互扩散系数随试验温度及表面镍浓度的提高而增大。只要合理选择放电条件下的各工艺参数 ,便可以有效控制渗层中的镍含量及分布。A new surface alloying method,double glow discharge nickelizing process on the surface of copper,was introduced in this paper.For the alloyed layer,the distribution of Ni content was measured,the isothermal mutual diffusion coefficient was calculated with diffusion couple method,and the factors affecting diffusion coefficient were discussed under double glow discharge condition.The results indicate that double glow discharge nickelizing on the copper surface is a course of absorption,deposition and diffusion of Ni.The isothermal mutual diffusion coefficient increases when the experimental temperature and Ni content on the surface are increased.So long as the experimental parameters are chosen reasonably,the distribution and content of Ni can be controlled in the alloyed layer.

关 键 词：纯铜 双层辉光放电 渗镍 扩散系数 

分 类 号：TG174.445[金属学及工艺—金属表面处理]