常温低浓度镀铬工艺研究  

Process of Cr electroplating at room temperature with low chromic anhydride content

作　　者：谭明辉 付军生 吴开源 

机构地区：[1]湘潭电机力源电镀热处理有限公司,湘潭411101

出　　处：《电镀与涂饰》2003年第6期20-22,61,共4页Electroplating & Finishing

摘　　要：提出了一种常温低浓度镀铬工艺。对该工艺所用镀液的深度能力、分散能力、阴极电流效率及其镀层的结合强度和耐腐蚀性能进行了测定。与传统的镀铬工艺相比,该工艺降低了生产成本,提高了生产效率。A process of Cr electroplating at room temperature with low chromic anhydride content was proposed. Covering power, throwing power and cathode current efficiency of solution, adhension and corrosion resistance of coatings were tested. Compared with traditional process of Cr electroplating, the process had lower cost and higher production efficiency .

关 键 词：镀铬 常温 低铬酐浓度 

分 类 号：TQ153.11[化学工程—电化学工业]