Bi2223/Ag高温超导带材连接技术的研究  

STUDY ON JOINING PROCESSES OF Bi2223/Ag HIGH TEMPERATURE SUPERCONDUCTING TAPE

作　　者：黄晖[1] 王秋良[1] 

机构地区：[1]中国科学院电工研究所应用超导技术研究室,北京100080

出　　处：《低温物理学报》2003年第A01期220-222,共3页Low Temperature Physical Letters

摘　　要：钎焊连接是Bi2 2 2 3/Ag高温超导带材实际应用最多的连接工艺 ,包括焊接温度、焊料和中间层设计等工艺环节 .本文首先对PIT工艺制备的Bi2 2 2 3/Ag高温超导带材开展了热处理温度 Ic 影响试验 ,通过实验筛选出适合Bi系带材的焊接加热温度 .用Sn96CuAg、Sn60PbAg、Sn60PbSb等三种焊料进行了Bi2 2 2 3/Ag高温超导带材钎焊实验 ,研究了钎焊工艺对焊接接头低温电阻影响 ,建立焊接接头电阻数学表达公式 ,并利用数学模型讨论了焊接中间层设计优化问题 .The effects of joining processes such as heating temperature, solder and shape of joined area on the electrical and mechanical properties of soldering joint between Bi2223/Ag tapes had been evaluated. Specifically, three kinds of solder Sn96CuAg, Sn60PbAg and Sn60PbSb were tested in joining Bi2223/Ag tapes. The resistance values of the three joints were calculated to be 10{-7}Ω magnitude in liquid Nitrogen temperature without loss of the critical current of the base Bi2223/Ag tapes.

关 键 词：高温超导 铋2223超导体 钎焊连接 临界电流 银包套 中间层设计 热处理 

分 类 号：O511.9[理学—低温物理]