装管密度对Bi-2223/Ag超导带材性能的影响  

The Influence of Packing Density on the Superconducting Properties of Bi-2223/Ag Tape

作　　者：邵惠明[1] 周廉[1] 张平祥[1] 冯勇[1] 段镇忠[1] 郑会玲[1] 唐晓东[1] 李成山[1] 张小聪[1] 孙祥云[2] 

机构地区：[1]西北有色金属研究院,陕西西安710016 [2]东北大学,辽宁沈阳110006

出　　处：《稀有金属材料与工程》2003年第10期832-835,共4页Rare Metal Materials and Engineering

基　　金："863"专项基金(2002AA306121);"973"国家重点基础研究基金(G19990646-05)

摘　　要：研究了不同装管密度对Bi-2223/Ag带材(19芯)性能的影响。结果表明:采用压棒装管工艺提高了带材芯丝的填充系统,有利于提高带材的工程电流密度;第一次热处理后带材表面的鼓泡明显比松装带材少,有利于提高电流沿长度方向上的均匀性,更适合制备长带。压棒装管带材与松装带材相比,宽展更大,最终热处理后芯丝致密,孔洞少,而且2223相含量高,最终带材的载流性能好于松装带材。The influence of initial packing density on the superconducting properties of Bi-2223 / Ag tape has been studied. The results indicate that the processing of cold-isostatic-pressing(CIP) can increase the fill factor and the J(c) of tape. The number of bubble after first heat treatment is reduced by CIP processing which can improve the uniformity of J(c) along the longitudinal direction to be more suitable for the fabrication of long Bi-2223/Ag tapes. During rolling, the CIP tape is more wider than the loose packed tape. With more fraction of Bi-2223 phase, dense core and less porosity, the J(c) of the CIP tapes is increased.

关 键 词：BI-2223/AG带材 压棒装管 填充系数 鼓泡 临界电流 

分 类 号：TM26[一般工业技术—材料科学与工程]