镍内电极多层陶瓷电容器的进展  

Progress of Nickel Electrode MLCC Technology

作　　者：张俊兵[1,2] 樊自拴[1,2] 孙冬柏 俞宏英[1,2] 孟惠民 李辉勤[1,2] 

机构地区：[1]北京科技大学腐蚀与防护中心,北京100083 [2]北京腐蚀,磨蚀与表面技术重点实验室,北京100083

出　　处：《电子元器件应用》2003年第12期1-3,21,共4页Electronic Component & Device Applications

摘　　要：介绍片式多层陶瓷电容器(MLCC)电极贱金属化(BME)涉及的主要技术及Ni内电极MLCC取得的进展。Ni内电极MLCC的可靠性已经达到空气烧结Ag/Pd内电极的水平。Ni内电极MLCC技术的成熟将使MLCC大容量、低成本、小型化取得更大进展并将取代部分Ta和Al电解电容器。The central technology involved in base metal electrode (BME) MLCC are introduced and the progress of nickel electrode MLCC are reviewed in this paper. The reliability of nickel electrode MLCC has reached the standard of Ag/Pd-electrode MLCC. Much more wonderful progress of MLCC towards high capacitance, miniature and low cost will be made by this technology. The MLCC are expected to replace some Ta and Al electrolytic capacitors.

关 键 词：片式多层陶瓷电容器 贱金属电极 镍内电极 元件 

分 类 号：TM534.1[电气工程—电器]