Al/Ti/Al复合层原位生成金属间化合物连接陶瓷  

Bonding Ceramics with Al/Ti/Al Multilayers by in Situ Formation of Intermetallic Compound

作　　者：邹贵生[1] 吴爱萍[1] 任家烈[1] 杨俊[1] 梁陈剑[1] 李晓宁[1] 

机构地区：[1]清华大学,北京100084

出　　处：《稀有金属材料与工程》2003年第12期981-985,共5页Rare Metal Materials and Engineering

基　　金：国家自然科学基金项目(50075046);清华大学骨干人才支持计划项目

摘　　要：用Al/Ti/Al复合层作连接材料,通过连接温度下原位生成金属间化合物真空连接Si3N4陶瓷。研究了Al与Ti的厚度匹配和工艺参数对接头显微组织及其强度的影响和接头的形成过程。结果表明:当原位生成的连接层金属组织为Al3Ti/Ti/Al3Ti时,由于纯金属间化合物Al3Ti脆性大,且其与剩余Ti片的结合强度低,陶瓷接头强度低;当连接层金属组织为大量Al3Ti颗粒加少量Al基固溶体时,连接层金属能获得良好的强化效果,与用纯Al连接的接头相比,接头室温和高温强度显著提高。Al与Ti的厚度匹配和连接参数适当时,接头室温和600℃剪切强度可分别达到89.4MPa和29.7MPa。Al/Ti/Al multilayer composites were used to bond Si3N4 ceramics by means of the in situ formation of intermetallic compound. The effects of the thickness matching between the Ti piece and Al piecs and other bonding parameters on the microstructures and strength of the ceramic joints were investigated. The results showed that joint strength is very low when the bonding zone is composed of Al3Ti/ Ti/ Al3Ti layers due to the brittleness of pure Al3Ti and the weak bond between Al3Ti and the residual Ti piece. Otherwise, if composed of a large number of Al3Ti particles and a small amount of Al-based solid solution, the bonding zone metal can be significantly strengthened and hence the joint strength significantly increased as compared with that of pure Al. The highest shear strength of joints at room temperature and 600 degreesC are up to 89.4 MPa and 29.7 MPa, respectiveliy, when the thicknesses of the Al piece and Ti piece are suitable and the optimal bonding parameters are adopted.

关 键 词：陶瓷 Al/Ti/Al复合层 金属间化合物 过渡液相扩散连接 高温强度 

分 类 号：TG407[金属学及工艺—焊接]