铜粉填充的导电涂料  

COPPER POWDER FILLED CONDUCTIVE COATING

作　　者：姜振华[1] 赵东辉[1] 林立民[1] 杨松茹[1] 汤心颐[1] 

机构地区：[1]吉林大学化学系

出　　处：《涂料工业》1992年第3期12-13,共2页Paint & Coatings Industry

摘　　要：本文叙述了以铜粉为填料、醇酸树脂为基料的导电涂料的制备,以及漆膜性能的测试方法。讨论了铜粉用量对漆膜表面电阻和使用性能的影响。实验表明,铜粉用量为60～65重量％时,漆膜的屏蔽电磁干扰效果和使用性能最佳。The preparation of a conductive coating,basedon alkyd resin as binder and copper powder asconductive filler, conductivity and applicationproperties have been studied.Experimently ithas been shown that with 60~65% (w/w) ofcopper powder,good effectiveness of electro-magnetic shielding and paint application proper-ties could be ensured.

关 键 词：涂料 导电涂料 铜粉 填料 醇酸树脂 

分 类 号：TQ637[化学工程—精细化工]