电弧钎焊条件下的熔滴铺展的数值模拟与分析  

Numerical Simulation and Analysis of the Droplet Speading under Arc Brazing

作　　者：周远远[1] 于治水[1] 王光耀[1] 

机构地区：[1]华东船舶工业学院材料与环境工程系,江苏镇江212003

出　　处：《华东船舶工业学院学报》2003年第6期38-41,共4页Journal of East China Shipbuilding Institute(Natural Science Edition)

基　　金：江苏省普通高校自然科学研究计划资助项目(01KJB46001)

摘　　要：针对电弧钎焊条件下的熔滴铺展进行了研究,从力和能量的角度建立了数学模型。采用Sur faceEvolver有限元分析软件进行了数值模拟,给出了电弧压力对熔滴铺展成型的影响规律。进而通过实验结果对该模型进行了验证,试验结果与模拟结果基本吻合。The behavior of the droplet spreading under arc brazing is studied, and the mathematic model accounting for the effect on force and energy is proposed. Use the Surface Evolver program to simulate the solder profile evolution and describe the effect on arcing pressure for the wetting and spreading of the droplet. Moreover, checking the results of numerical simulation by experiment, the results of calculation are in well correspondence with simulated experiment.

关 键 词：润湿和铺展 SurfaceEvolver软件 数值模拟 电弧压力 高速摄像 

分 类 号：TG444.74[金属学及工艺—焊接]