阵列式微型透镜封装多芯片COB LED的光学仿真设计及应用  

Optical stimulation and application of multi-chip COB LED packaging with minitype lens array

作　　者：林丞[1,2] 

机构地区：[1]厦门大学物理学博士后流动站,福建厦门361005 [2]厦门华联电子有限公司,福建厦门361006

出　　处：《应用光学》2014年第6期1063-1068,共6页Journal of Applied Optics

基　　金：国家863计划项目(2013AA03A107)

摘　　要：为了提高COB LED的取光率,以1919COB LED为研究对象,建立阵列式圆锥透镜、半椭球透镜、四棱锥透镜和半圆球透镜封装LED模型,并利用光学仿真软件进行研究。仿真实验结果表明:在优化条件下,高0.5mm、直径0.9mm的阵列圆锥透镜封装LED的光通量由平面封装的67lm提高至84.3lm,即取光率提高25.8%。制作了RGB芯片的多芯片LED样品,并用直径1mm的阵列半圆球透镜进行封装,其取光率提高18.8%。Recently ,high power multi‐chip chip on board (COB) LED has become the industrial trends ,duo to its advantages ,such as higher packaging density ,higher thermal stability ,wider irri‐tation angle and etc .However ,low light extraction efficiency of COB LED restricts its application and development .In order to improve the light extraction efficiency of LED ,the models of COB LED packaged by cone arrays ,half‐ellipsoid arrays ,rectangular pyramid arrays and hemisphere array were established and investigated by applying stimulation software .The stimulation result showed that un‐der optimal conditions ,the luminous flux of COB LED with 0 .9 mm height and 0 .5 mm diameter cone array lens increased from 67 lm to 84 .3 lm ,that is ,light extraction efficiency increased by 25 .8% .Finally ,LED samples with RGB multi‐chips were packaged by 1 mm diameter hemisphere array ,and the light extraction efficiency increased by 18 .8% .

关 键 词：阵列式透镜 COB 光学仿真 LED封装 取光率 

分 类 号：TN312.8[电子电信—物理电子学]