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机构地区:[1]深圳市大族数控科技有限公司,广东深圳518057
出 处:《印制电路信息》2015年第3期46-50,共5页Printed Circuit Information
摘 要:通讯行业的发展对高频电路板制造的需求越来越高,为确保高频信号的完整性和阻抗连续性,在PCB制造过程中采用和常规制造不同的工艺流程。全工艺流程的核心工艺为背钻工艺,背钻工艺采用有特殊控深功能的PCB数控机械钻孔机对多余的过孔分支进行钻除。在背钻加工过程中,钻深和钻浅是影响背钻功能的两大因素,特别是钻深。如果在加工过程中出现钻深,该通讯背板将无法使用,直接造成报废。通讯背板单价昂贵,且背钻工序处于全工序的后段工序,所以对设备和工艺可靠性要求很高。本文从PCB数控背钻机械钻孔机设备和背钻钻孔工艺的角度,对引起钻孔深度异常的原因进行大量的实验和分析,并给出可行的处理办法。The telecommunication industry development imposes growing high requirements on high frequency PCB manufacturing. And in order to keep high frequency signal integrity and consistent impedance, the process and technology different from conventional manufacturing must be used. The core of such a full process is backdrilling process, which utilizes special depth controlled PCB CNC drilling machine to drill redundant via branches. During backdrilling process, over-depth(overrun) or under-depth(underrun) are the two main factors which affect backdrilling functionality and quality, especially, if over-depth occurred, it will cause direct faulty of backplane board and lead to backplane board malfunction. As a result, backplane can't be used anymore. The expense of backplane board is high and usually backdrilling is in the last stage of whole backplane board manufacturing. Thus it needs high reliability on drilling equipment and process. From the point of backdrilling process and PCB CNC drilling machine control, this paper analyzed over-depth root causes based on a large amount of real tests and gave a practical solution method on over-depth drilling issue.
关 键 词:背钻 钻深 钻浅 通讯背板 PCB数控背钻机械钻孔机
分 类 号:TN41[电子电信—微电子学与固体电子学]
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