龙门线设备进行填孔电镀工艺的应用  

Application of hole filling plating process of vertical line equipment

作　　者：肖正峰[1] 

机构地区：[1]天津普林电路股份有限公司,天津300308

出　　处：《印制电路信息》2015年第3期128-132,共5页Printed Circuit Information

摘　　要：为了满足PCB的高密度互联,诞生了填孔电镀工艺。但是VCP生产线及不溶性阳极生产设备的设备成本巨大,为了降低设备成本的投入,尝试了利用现有龙门线设备、普通的可溶性阳极、D公司填孔药水进行填孔电镀工艺的可行性验证。经过各种方案的实践,最终确定了此工艺的流程及加工参数。最终产品完全可以满足盲孔对微凹的要求、通孔的镀铜厚度要求、各种可靠性要求,并已启用该设备进行填孔生产板的批量加工。In order to meet the high density interconnection need, the via-filling plating process was born. But VCP production line and insoluble anode equipment are very expensive. In order to decrease equipment cost, we tried to use existing vertical line equipment, common soluble anode and Dcompany via-filling liquid to validate feasibility of via-filling plating process. Through experiment of various kinds of plan, we finally fixed the process flow and machining parameter. The terminal product could completely fill the blind via's dimple requirement, the via's copper thickness requirement and other stability requirement. And this equipment has been put into mass production for via filling PCB.

关 键 词：填孔电镀 龙门线 成本 流程 加工参数 

分 类 号：TN41[电子电信—微电子学与固体电子学]