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作 者:侯羽[1] 范和平[1] 张雪平[2] 石玉界[2] 刘莎莎[2]
机构地区:[1]江汉大学柔性显示材料与技术湖北省协同创新中心,湖北武汉430074 [2]华烁科技股份有限公司,湖北武汉430074
出 处:《印制电路信息》2015年第3期160-164,共5页Printed Circuit Information
摘 要:包封膜是挠性印制电路板(FPC)的外层保护材料,用于保护未经特殊处理的线路不受环境和人为因素的损害。文章制备出一种可快速固化的白色涂料,涂覆于PI薄膜上,应用于FPC包封膜的生产中,可以提高生产效率,降低生产成本。文章主要研究了涂料的固化工艺、热学性能及涂层的白度、光泽度、附着力、剥离强度、耐锡焊性等性能。实验结果表明,涂料具有固化速度快、附着力强、柔韧性好、耐热性能优越等特点,满足FPC包封膜生产需求。Encapsulation film is the shielding material of flexible printed circuit board(FPC), used to protect lines without special treatment from damage of environmental and human factors. In this paper, a fastcuring white coating was prepared. It can improve the production efficiency and reduce production costs as this coating is coated on PI film, applied to the production process of FPC encapsulation film production. In this paper, the coating curing process, thermal properties, whiteness and gloss, adhesion, peel strength, resistance to soldering and other properties were studied. The results showed that, the coating had the characteristics of fast curing speed, strong adhesion, good flexibility and excellent heat resistance, meeting the demand of FPC encapsulation film production.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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