电子工业用引线框架铜合金及组织的研究  

Progress of Study on Lead Frame Copper Alloy and Its Implementation in Electronic Industry

作　　者：谢水生[1] 李彦利[1] 朱琳[1] 

机构地区：[1]北京有色金属研究总院加工工程研究中心,北京100088

出　　处：《稀有金属》2003年第6期769-776,共8页Chinese Journal of Rare Metals

基　　金：国家 8 63计划重大专项课题资助项目 ( 2 0 0 2AA3Z10 0 0 )

摘　　要：随着电子信息产品向小型化、薄型化、轻量化和智能化发展 ,对引线框架材料的强度和导电性提出了更高要求。本文在简单介绍电子工业用合金发展的基础上 ,较详细地介绍了日本推出的引线框架合金品种及主要成分、抗拉强度和导电率。同时 ,阐述了引线框架材料的特点和提高材料性能的可能途径 :改变合金的成分 ;采取合理的热处理及加工方法改变其组织结构 ,如固溶强化、析出强化、斯皮诺达分解、弥散强化等。采用几种强化机制适当组合 ,能够大幅度改善材料的抗拉强度和导电率。As the development of electronic industries, the product becomes smaller, thinner, lighter and intelligent. A problem that how to make the higher intensity and higher conductivity rises. The development history of lead frame copper alloy was introduced. The compositions, intensity and conductivity of lead frame copper alloy were analyzed in detail. The problems that how to get lead frame copper alloy with higher performances, such as solution streng thening, segregation strengthening, dispersion strengthening, etc., were discussed. When a comprehensive strengthening procedure is used, the tensile strength and conductivity of materials may be improved significantly.

关 键 词：电子工业 高精度板带材 引线框架材料 铜合金 固溶强化 析出强化 弥散强化 

分 类 号：TG146.1[一般工业技术—材料科学与工程]