密度对粘结钕铁硼永磁元件性能的影响  

Effect of Density on Properties of Bonded NdFeB Devices

作　　者：李军[1] 刘颖[1] 高升吉[1] 涂铭旌[1] 

机构地区：[1]四川大学材料科学与工程学院,四川成都610065

出　　处：《电子元件与材料》2004年第2期38-40,共3页Electronic Components And Materials

基　　金：国家863计划资助项目(2001AA324030)

摘　　要：密度是影响模压粘结钕铁硼永磁元件性能的关键因素。研究了密度对模压粘结钕铁硼元件磁性能和抗蚀性能的影响,研究表明:随着元件密度的提高,其磁性能Br、Hcb和(BH)max逐渐增大,Hcj逐渐下降;无论元件涂层与否,密度高的元件抗蚀性能较高。要提高元件的密度,粒度配合、预压成型等方法是有效的途径。Density is one of the key factors that affect the properties of the bonded NdFeB devices. The effects of density on the magnetic properties and corrosion resistance were investigated. The results demonstrate that when the density increases Br, Hcb and (BH)max increase, while Hcj decreases. The devices of higher density have higher corrosion resistance, with coating or not. Density can be effectively increased by well-distributed particle size, pre-molding, etc.

关 键 词：密度 磁性能 抗蚀性能 

分 类 号：TM273[一般工业技术—材料科学与工程]