SiO_2微粉分形分布对超薄切割砂轮片拉伸性能的影响  

DEVELOPMENT OF PHOTOSENSITIVE RESIN CUTTING BLADES USING FRACTAL ANALYSIS

作　　者：姚春燕[1] 彭伟[1] 高涛[1] 

机构地区：[1]浙江工业大学机电工程学院先进制造技术研究所,杭州310014

出　　处：《金刚石与磨料磨具工程》2003年第6期16-18,共3页Diamond & Abrasives Engineering

基　　金：国家自然科学基金资助项目(项目编号:50075084);浙江省教育厅科研计划项目(项目编号:20030128)

摘　　要：在研究利用光敏树脂快速成型工艺制作超薄切割砂轮片时,发现往光敏树脂中添加适量的SiO2微粉,光敏树脂的拉伸强度明显增加。添加的SiO2微粉的用量的不同,在光敏树脂中形成的分形分布不同,对光固化成型后的超薄切割砂轮片的拉伸强度有不同的影响。本文通过研究SiO2微粉在光敏树脂中分布特征,根据分形理论,用分形维来描述其分布特征及其对光敏树脂光固化成型后的超薄切割砂轮片的拉伸性能的影响。When studing the manufacture technique of photosensitive resin bonded cutting blade with the rapid moulding process, it is found that the tensile strength of photosensitive resin can be significantly improved by adding a proper amount of SiO2 ultrafine particles. It is also discovered that different amount of SiO2 additive form different fractal distributions in the photosensitive resin. Such distribution characteristics affect the tensile strength of the thin cutting blade. This paper studied the particle distribution characteristics using fractal theory and investigated the relationship between the fractal dimensions and the tensile strength of the cutting blade made with photosensitive resin.

关 键 词：光敏树脂分形维 超薄切割砂轮片 SIO2微粉 拉伸性能 

分 类 号：TG743[金属学及工艺—刀具与模具]