现代微光电子封装中的倒装焊技术  

Flip chip bonding technology used in modern micro-photoelectron package

作　　者：裴为华[1] 邓晖[1] 陈弘达[1] 

机构地区：[1]中国科学院半导体研究所集成光电子学国家重点实验室,北京100083

出　　处：《微纳电子技术》2003年第7期231-234,共4页Micronanoelectronic Technology

基　　金：国家自然科学基金重大资助项目(9698962 60 );重点资助项目(6978980 2 );国家"863"高技术资助项目(2 0 0 1AA3 12 80 ;2 0 0 2AA3 12 2 40;2 0 0 1AA12 2 0 3 2 )

摘　　要：结合我们设计制作的倒装焊光电子器件—智能像素面阵 ,对倒装焊的工艺过程作了简要的介绍。该面阵采用铟做凸点材料 ,制作了输入输出数达 6 4× 6 4的凸点电极阵列 ,并采用回流焊的方式 ,将光电调制器面阵与对应的处理电路芯片对准后加热回流实现焊接 ,形成输入输出引线间距只有 80The flip chip bonding process in making our photoelecton device (smart pixels) was described, and flip chip bonding technique was introduced briefly. In was used to make the bonding bumps, and a 64×64 bump array was fabricated. After the photo electron modulator array and corresponding IC were aligned in a special instrument which could realize micron precision, the two chips were heated and the bumps reflow and the soldering was sealed, the pitch is 80 microns.

关 键 词：微光电子封装 倒装焊技术 光电子器件 光电子集成 微电子电路 

分 类 号：TN491[电子电信—微电子学与固体电子学]