氰酸酯树脂在高性能印刷电路板中的应用概况  

A Review of Applications of Cyanate Resin in High Performance PCB

作　　者：曾志安[1] 陈立新[1] 唐玉生[1] 

机构地区：[1]西北工业大学化工系,陕西西安710072

出　　处：《中国塑料》2003年第5期19-23,共5页China Plastics

摘　　要：综述了氰酸酯树脂及氰酸酯改性环氧树脂在高性能印刷电路板中的应用。论述了氰酸酯改性环氧树脂的机理与性能。以改性树脂基体制备的覆铜板介电性能明显得到提高 。Application of cyanate ester resin(CE)and CE modified epoxy in high performance printed circuit board(PCB) is reviewed.The mechanism of modification of CE on epoxy and properties of CE modified epoxy are discussed. The dielectric performance of copper claded board made from the modified epoxy is enchanced remarkably and can meet the high frequency requirements.

关 键 词：氰酸酯树脂 环氧树脂 印刷电路板 介电性能 

分 类 号：TQ323.8[化学工程—合成树脂塑料工业]