化学镀技术在陶瓷二次金属化中的应用  

Application of Electroless Nickle Plating in Metalized Ceramics

作　　者：何宏庆[1] 

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2015年第3期61-63,共3页Vacuum Electronics

摘　　要：本文根据陶瓷金属封接对钎焊的需要,首次将化学镀Ni-B合金技术应用于陶瓷金属化领域,通过对目前国内比较成熟的化学镀镍液配方进行初步试验的基础上,研究确定了更适合金属化陶瓷的化学镀还原剂,确定了各种添加剂的种类和添加剂的用量比例,并且通过对整个化学镀过程的研究及实验最终确定了金属化陶瓷化学镀镍液的配比,研究结果表明化学镀Ni-B合金镀层稳定可靠,完全满足陶瓷金属封接的工艺要求。This paper first used Ni-B Electroless nickel plating technology to the metallization of ceramic and metal parts of the sealing technology after referrece the other Ni-B Electroless nickel plating technology.At present,domestic chemical nickel plating solution formula is mature.On this basis,did some basic experiments to investigate more appropriate electroless plating recipe for metalized ceramics.Research has identified more suited reducing agent,various kinds of additives and additive dosage.And eventually systematic electroless nickel plating technology used for metalized ceramics has been confirmed through the study and experiment of the whole electroless plating process

关 键 词：化学镀 Ni-B合金 金属化陶瓷 

分 类 号：TQ172.6[化学工程—水泥工业] TB306[化学工程—硅酸盐工业]