电子封装用碳纤维/铜复合材料制备与性能研究  

Preparation and Property Studies of Carbon Fiber/Copper Composite Materials for Electronic Packaging

作　　者：乐青[1] 周灵平[1] 朱家俊[1] 李德意[1] 

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082

出　　处：《真空电子技术》2015年第5期36-39 51,51,共5页Vacuum Electronics

摘　　要：采用对长径比为300左右的短碳纤维直接电镀铜的方法,获得了碳纤维体积分数为20%,25%和30%的碳纤维铜复合丝,然后将得到的碳纤维铜复合丝进行热压烧结制备碳纤维铜复合材料,并对复合材料组织、热导和热膨胀性能进行了研究。结果表明:电镀得到的铜层比较均匀,镀层厚度可控,镀铜碳纤维之间形成"搭接"结构;经过热压烧结后,碳纤维在基体中分布均匀,碳纤维铜界面结合良好。热性能测试表明,随着碳纤维体积分数的增加,复合材料的热导率及热膨胀系数均随之降低。By direct electroplating copper on carbon fibers(CFs)with a length to diameter ratio of about 300,carbon fiber/copper composite filaments with the carbon fiber volume fractions of 20%,25%and 30% were acquired respectively,and then carbon fiber/copper composites were prepared by consequent hot-pressing sintering.The microstructure,the thermal conductivity and the thermal expansion property of the composites were studied.The results showed that the copper coatings were uniform and the thickness was controllable,and 'overlap joint'was formed between copper coated carbon fibers.After hot pressing sintering,carbon fibers were distributed homogeneously in the matrix,and the interface bonding between carbon fiber and copper was very stable.Thermal performance tests showed that the thermal conductivity and the thermal expansivity of the composites decrease with the carbon fiber volume fraction increasing.

关 键 词：电镀 真空热压 金属基复合材料 热物理性能 

分 类 号：TN05[电子电信—物理电子学] TB33[一般工业技术—材料科学与工程]