化学镀镍液中硫酸镍与次磷酸钠的快速测定  

Rapid Determination of Nickel Sulfate and Sodium Hypophosphite in Electroless Nickel Plating Bath

作　　者：徐启文[1] 吴源清[1] 黄岳山[1] 赵修华[1] 

机构地区：[1]华南理工大学生物力学研究所,广东广州510641

出　　处：《电镀与精饰》2004年第1期31-33,共3页Plating & Finishing

基　　金：广东省自然科学基金资助项目 (0 2 0 832 );广州市重点科技攻关项目 (2 0 0 0 - Z- 0 18- 0 1)

摘　　要：采用光度分析方法研究化学镀镍过程中硫酸镍及次磷酸钠质量浓度的快速测定 ,建立了标准硫酸镍及标准次磷酸钠质量浓度与吸光度回归方程。对比试验表明 ,镀液测定的标准偏差小于4% ,与化学分析标准法相比 ,其偏差可控制在 6%左右。本法适用于快速检测镀液中主成分含量的变化。Rapid determination of nickel sulfate and sodium hypophosphite in electroless nickel plating bath was investigated using spectrophotometry. The regression equations of the relationship between absorbance and nickel sulfate concentration, and between absorbance and sodium hypophosphite concentration in the standard solutions were established. Experimental results of comparison test show that the standard deviation of determiantion of the spectrophotometric method for plating bath is less than 4%, and it can be controlled in about 6% as compared with the standard method of chemical analysis. The method is suitable for rapid determining the change of main components in the plating bath.

关 键 词：化学镀镍 硫酸镍 次磷酸钠 快速测定 分光光度法 

分 类 号：TQ153.11[化学工程—电化学工业]