化学镀Ni-Cu-P合金工艺及性能研究  

Process and Property of Electroless Ni-Cu-P Alloy Deposits

作　　者：徐瑞东[1] 郭忠诚[1] 王军丽[1] 薛方勤[1] 

机构地区：[1]昆明理工大学材料与冶金工程学院,云南昆明650093

出　　处：《表面技术》2004年第1期45-47,共3页Surface Technology

摘　　要：　研究了化学镀Ni Cu P合金镀液组成及操作条件对镀层厚度及硬度的影响。筛选出了体系的最佳工艺条件,获得了82.391%Ni 10.298%P 5.297%Cu的合金镀层,其硬度在450～500HV之间。X射线衍射表明:Ni Cu P合金镀层在镀态下为非晶态结构,但镀层经400℃和600℃热处理后,其结晶区域有Ni3P、Cu3P等特征的衍射峰出现,表明镀层为晶态结构。此外,研究表明:镀层厚度随硫酸镍浓度、次亚磷酸钠浓度、镀液温度及pH值的升高而增加,随硫酸铜浓度、络合剂浓度的升高而降低。The effects of bath compositions and operating conditions on the thickness and hardness of the electroless Ni-Cu-P alloy deposits are studied.The best process conditions are screeded out and the alloy deposits with 82.391wt%Ni,10.298wt%P and 5.297wt%Cu have been obtained,the hardness of the deposits is between (450～500Hv).X-ray displays that the (Ni-Cu-P) alloy coating is amorphous state (as-deposited) and a great amount of Ni_3P and Cu_3P phase appears in crystal area with strong characteristic peak.which is the typical characteristic of crystalline state after heat treatment at 400℃ and 600℃.Furthermore experimental results show that the thickness of deposits increases with improving the concentrations of NiSO_4·7H_2O,NaH_2PO_2·H_2O,bath temperature and pH value,and decreases with improving the concentrations of CuSO_4·5H_2O and complexing agent.

关 键 词：化学镀 Ni-Cu-P合金镀层 镀层厚度 硬度 晶态结构 残磁性能 

分 类 号：TQ153.2[化学工程—电化学工业]