离心高速电镀铬工艺研究  

Study of centrifugal high-speed chromium plating

作　　者：董海峰[1] 邵光杰[1] 

机构地区：[1]燕山大学环境与化学工程系,河北秦皇岛066004

出　　处：《电镀与涂饰》2004年第1期31-32,35,共3页Electroplating & Finishing

摘　　要：　为提高圆筒状工件内壁电镀铬的沉积速度,采用自行研制的离心高速电镀铬装置。研究了电流密度与沉积速度、晶粒尺寸及镀层硬度的关系。结果表明,离心高速电镀铬的极限电流密度及沉积速度、镀层硬度均增大,镀层晶粒更细致。Self-designed centrifugal high-speed chromium plating device was adopted to raise deposition rate for inner surface of cylindric works. The relationships of current density with deposition rate, crystal size and hardness of deposit were studied. Results show that limit current density, deposition rate and hardness were all increased, and crystal of deposit was finer.

关 键 词：镀铬 离心 高速 

分 类 号：TQ153.11[化学工程—电化学工业]