低黏度室温固化环氧灌封胶的研制  

Study on low viscosity and room temperature cureble epoxy resin pouring sealant

作　　者：廖宏[1] 马玉珍[1] 魏大超[1] 李熠[1] 

机构地区：[1]中国工程物理研究院化工材料研究所,四川省绵阳市621900

出　　处：《粘接》2004年第1期12-14,共3页Adhesion

摘　　要：在配方中采用了低黏度的室温固化剂和耐热性能良好的丁腈橡胶 ,降低了体系的黏度 ,改善了环氧树脂灌封胶的耐热性能。实验确定了灌封胶的配比 ,并考核了胶的理化性能、工艺性能、热反应性能、耐高温性能等。结果表明 :本灌封胶固化反应缓和、短时间耐 30 0℃高温、柔韧性好、黏度低 ,适宜作为狭窄腔体的灌封胶。By adding a room-temperature curing agent with low viscosity and the nitrile rubber with good heat resistance the pouring sealant with low viscosity and improved heat resistance was prepared.The composition was determined and its physical and chemical properties,processability,curing reaction exothermicity and heat resistance were examined.The results showed that the curing reaction of the sealant was moderate,the sealant can endure high temperature of 300℃ for a short period and had good flexibility and low viscosity,so that the sealant is suitable for using in the narrow slit spaces.

关 键 词：环氧灌封胶 固化剂 丁腈橡胶 稀释剂 工艺性能 热反应性能 耐高温性能 

分 类 号：TQ433.437[化学工程]