试论集成电路芯片生产的职业卫生管理  

A preliminary exploration on the characteristics of occupational hazards and its management strategy in integrated circuit chips manufacturing

作　　者：高金平[1] 吴世达[1] 胡天锡[1] 

机构地区：[1]上海市疾病预防控制中心,上海200336

出　　处：《中国卫生工程学》2004年第1期3-6,共4页Chinese Journal of Public Health Engineering

摘　　要：目的　探讨集成电路芯片制造中容易导致泄漏和火灾的各项职业病危害要素的管理策略以及应急事故管理策略。方法　对现有的集成电路芯片制造业采取的安全卫生防护措施及管理方法进行收集和分析。结果　提出适当和切实可行的职业安全卫生防护重点以及如何加强化学物质、特殊气体、物理因素、生产设备、操作人员、废弃物、应急事故、监测监护和教育培训等管理策略。结论　集成电路芯片制造中职业病危害是可以预防和控制的。Object Discuss management strategy of occupational hazards emphasis that is easy to leed to leaking and firing and unexpected accidents.Methods Colled and analysis the data for safety and health preventive measures and management methods in chips manufacturing.Results Bring forward the practicable prevention emphases for occupetional safety and health, and management strategy for chemical, special gas, physical agents, facility operation, offal, air measurement, physical examine, emerency accident and training etc.Conclusion Occupational hazards could be controlled and prevented in integrated circuit chips manufacturing.

关 键 词：集成电路芯片 职业卫生 卫生管理 职业病 芯片制造 集成电路 

分 类 号：R13[医药卫生—劳动卫生]