限流用BaTiO_3系PTC陶瓷的制备及影响因素  

PTC Ceramics of BaTiO_3 System for Current-limitation: Preparetion and Influencing Factors

作　　者：畅柱国[1] 张建军[1] 赵丽丽[1] 贾金亮[1] 崔斌[1] 吴淑荣[1] 熊为淼[1] 

机构地区：[1]西北大学化学系,陕西西安710069

出　　处：《电子元件与材料》2004年第4期25-28,共4页Electronic Components And Materials

基　　金：陕西省教委专项基金资助项目(02JK058);西北大学校内基金资助课题(02NW13)

摘　　要：介绍了以钛酸四丁酯和自制高纯醋酸钡为主要原料,采用溶胶–凝胶一步法(sol-gel)制备限流用BaTiO3系PTC陶瓷材料的工艺路线,用正交实验法研究了Ti/Ba,Pb,Ca,Y,Mn等组分因素对PTC陶瓷材料性能的影响。优化确定了PTC陶瓷材料的较佳组成。在基方固溶体化学组成,原材料选择和复合添加物的改性,特别是烧结工艺等方面做了细致的工作。最终获得了居里温度(tC)100℃,室温电阻率(r25) ≤20 ·cm,升阻比(Rmax / Rmin)>105,温度系数(aR)≥15% /℃,耐电压(Vb)≥190 V·mm1的PTC陶瓷材料。PTC ceramics of BaTiO3 system for current-limitation was prepared by sol-gel in one step, with Ti(OC4H9)4 and Ba(Ac)2 as raw materials. The effects of the composition, including Ti/Ba, Pb, Ca, Y and Mn, on the properties was investigated by orthogonal experimental method. The optimized composition was determined. Investigations on the composition of the basic solid solution, the selection of the raw material and the modification of the complex additives were described. Of the required ceramics, the Curie temperature (tC) is 100, room temperature volume resistivity (r25)≤20 cm, jump range (Rmax/Rmim) >105, temperature coefficient of resistivity (aR)≥15%1, and dielectric strength (Vb) ≥190 V·mm1.

关 键 词：高性能陶瓷材料 过电流保护 溶胶-凝胶法 烧结添加物 正交实验 

分 类 号：TN373[电子电信—物理电子学]