硫脲对镍电沉积的作用  

Effect of Thiourea on Nickel Deposition

作　　者：胡光辉[1] 吴辉煌[1] 杨防祖[1] 王森林[1] 

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电化学》2004年第1期94-97,共4页Journal of Electrochemistry

基　　金：国家自然科学基金(20073035)资助

摘　　要：　应用循环伏安和阻抗＿电位法研究了硫脲(TU)对玻碳电极和镀镍玻碳电极上镍沉积过程的影响.结果表明,在玻碳电极上镍的电沉积呈现明显的电化学成核机理,而在镀镍玻碳电极上则无此特征.TU的存在虽阻碍了Ni晶核的形成,但却能加速晶粒的生长.Effect of thiourea on nickel deposition at glassy carbon and nickel-deposited glass carbon electrodes was investigated with cyclic voltammograms and impetance-potential curves. It was found that the nucleation processes occurred at the glassy carbon electrode. However, this characteristics disappeared at the nicked-deposited glassy carbon electrode. It was suggested that the presence of thiourea hindered the nucleation processes, yet accelerated grain growth.Curves of impetance-potential could sensitively detect effect of thiourea on nickel depositon and reflect changes in rate-determining step with potential.

关 键 词：硫脲 电沉积镍 循环伏安 阻抗-电位法 化学镀镍 加速作用 作用机理 玻碳电极 镀镍玻碳电极 

分 类 号：O646[理学—物理化学]