高导热AlN陶瓷烧结助剂的研究现状  

Development of Sintering Aids for AlN Ceramics with High Thermal Conductivity

作　　者：陈广乐 范仕刚 夏淑琴 黑江涛[2] 

机构地区：[1]中非人工晶体研究院研发中心,北京100018 [2]山东工业陶瓷研究设计院,淄博255031

出　　处：《现代技术陶瓷》2004年第1期26-30,共5页Advanced Ceramics

摘　　要：在分析了陶瓷的导热机理的基础上 ,着重评述介绍了几种复合烧结助剂在制备高导热AlN陶瓷过程中的作用机理 ,对比了AlN陶瓷样品的热导率值。分析了晶界相的形成和AlN晶格的净化 ,从而减少了氧缺陷 ,提高了陶瓷材料的致密度和热导率。AlN ceramics with high thermal conductivity is a very promising material for electronic substrates . Based on the mechanism of thermal conduction, the authors discussed the effect of several compound sintering aids on the densification and the thermal conductivity . It is shown by analysis that the removal of oxygen-related defects from AlN grains is significant to improve the thermal conductivity and to strengthen the densification. The oxidation reactions between AlN powder and oxide additives were described in this study.

关 键 词：AIN陶瓷 烧结助剂 添加剂 导热机理 热导率 晶界相 致密度 电子装置 

分 类 号：TQ174.756[化学工程—陶瓷工业]