化学镀镍层与Si_3N_4陶瓷的界面反应  

The Interface Reaction of Chemical Ni-plating Layer and Si_3N_4 Ceramic Substrate

作　　者：张永清[1] 任家烈[2] 赵彭生[3] 

机构地区：[1]中国科学院电子学研究所微波器件中心,北京100080 [2]清华大学机械工程系,北京100084 [3]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《中国表面工程》2004年第2期33-36,共4页China Surface Engineering

基　　金：国家自然科学基金资助项目(59175211)

摘　　要：采用真空加热和辉光离子轰击加热两种方式,对化学镀镍Si3N4陶瓷进行扩散热处理,并利用X射线衍射仪分析和讨论了化学镀Ni层与Si3N4的界面反应。分析表明,辉光离子轰击扩散能够显著促进镀Ni层与Si3N4的界面反应,其界面反应产物为Ni2Si、Ni3Si和Ni5Si2。随着扩散热处理温度的提高,反应产物的数量明显增加。处理前后,化学镀镍Si3N4陶瓷与金属钎焊接头剪切强度可由70 MPa提高至123 MPa。In this paper, two different methods of vacuum heating and glow discharge ion bombardment heating were used to promote the reaction at the interface of chemical Ni-plating layer and Si3N4 substrate, it was analysed by X-ray diffraction and discussed. The results indicated that the interface reactions were remarkably promoted by glow discharge diffusion, the interface reaction products were Ni2Si,Ni3Si and Ni5Si2. If a chemical Ni-plating layer / Si3N4 sample was tempered by a high-temperature diffusion treatment of glow discharge, the interface reaction products increased. The joint shear strength of Ni plated Si3N4 ceramics increased from70 MPa to 123 MPa after the glow discharge diffusion treatment.

关 键 词：化学镀镍 陶瓷 界面反应 

分 类 号：TG454[金属学及工艺—焊接]