环氧胶粘涂层中温度应力的有限元分析  

Finite Element Analysis of Inner Stress in Epoxy Adhesive Layer

作　　者：杨春梅[1] 郑小玲[1] 余海洲[1] 

机构地区：[1]三峡大学机械与材料学院,湖北宜昌443002

出　　处：《三峡大学学报（自然科学版）》2004年第2期160-162,共3页Journal of China Three Gorges University：Natural Sciences

摘　　要：用有限元分析了板上堆覆胶层固化后内应力的分布,着重研究了板上堆覆胶层固化完成后环境温度发生变化时,平行于环氧树脂基体界面的胶层中不同深度处纵、横向应力的变化情况及胶层宽度对胶层应力分布的影响,还研究了同一深度胶层的应力分布.有限元分析结果与实测计算结果吻合:紧邻树脂基体-金属界面处的内应力最大.The inner stress in adhesive layer deposited on steel plate after the curing procedure is analyzed u-sing the finite element method. The distribution of stress at arranged depth of epoxy resin layer because of the change of environment temperature after the curing procedure and the influence of deposited area on the inner stress of adhesive are discussed in detail. In addition,the stress distribution of a depth of epoxy resin layer is analyzed. Results obtained from experiment agree with that from finite element analysis:the inner stress at the point near the interface is highest.

关 键 词：堆覆胶层 内应力 环氧树脂 有限元 横向应力 

分 类 号：TG491[金属学及工艺—焊接]