片式BaTiO_3基PTCR注浆成型研究  

Research on Slipcasting Process for BaTiO_3-based Chip PTCR

作　　者：刘欢[1] 龚树萍[1] 陈艳[1] 郑志平[1] 周东祥[1] 

机构地区：[1]华中科技大学电子科学与技术系,武汉430074

出　　处：《无机材料学报》2004年第3期676-680,共5页Journal of Inorganic Materials

基　　金：国家863项目(2001AA325040)

摘　　要：研究了片式BaTiO_3基PTCR元件石膏模注浆成型工艺,通过控制pH值、粘合剂及分散剂的含量,获得具有较高固相比和较低粘度的浆料.在PVA和分散剂占粉料质量比分别为0.8％和0.4％且pH=9时,获得的浆料最高固相质量分数为80％(固相体积分数为55％).利用注浆成型能够通过模具尺寸及吸浆时间来控制膜厚的特点,成功制备出厚度为0.4mm且具有一定强度和密度的生坯,并考察了注浆成型瓷片的PTCR效应,且对成型过程中的一些现象作出了分析和讨论.In order to acquire highly concentrated BaTiO3 slurry suitable for slipcasting process, the factors, that may influence the property of slurry, were investigated. The results obtained show that when pH=9 and the weight concentration of PVA and dispersant is 0.8% and 0.4% respectively, the solids loading as high as 80wt%(55vol%) can be achieved. In addition, The PTCR effect of chip PTCR formed by this slipcasting process was examined.

关 键 词：片式PTCR 注浆成型 浆料 

分 类 号：TN605[电子电信—电路与系统] TQ174[化学工程—陶瓷工业]