纯铜双层辉光离子渗钛组织形成机理及性能分析  

Investigation on the formation and properties of titanizing layer made by double glow discharge process on the surface of pure Cu

作　　者：袁庆龙[1] 池承忠[1] 苏永安[1] 徐重[1] 

机构地区：[1]太原理工大学表面工程研究所,山西太原030024

出　　处：《电子显微学报》2004年第2期163-167,共5页Journal of Chinese Electron Microscopy Society

摘　　要：采用双层辉光离子渗金属技术对纯铜进行了渗钛处理。用配有能谱仪(EDS)的扫描电子显微镜(SEM)、X射线衍射仪和透射电子显微镜对合金层的显微组织形貌、钛含量分布、相组成及相结构类型进行了观察与测定,对合金层的形成机理进行了探讨,并对其性能进行了对比测定。结果表明:渗钛层由合金层和扩散层组成,合金层主要由TiCu+(Cu)固溶体+TiCu4构成,TiCu4为D1a型有序相,TiCu为B2型有序相,扩散层为(Cu)固溶体。渗钛处理后纯铜的表面得到显著强化。The surface of pure copper was titanized by double glow discharge process. The cross-section microstructure and surface morphology, Ti concentration and phase structure of titanizing layer were examined and measured by SEM equipped with EDS, XRD and TEM. The formation mechanism of titanizing layer was discussed and its properties were measured. The results indicated that the titanizing layer was composed of the diffused layer and alloyed layer, and its structure consisted mainly of TiCu+(Cu)+TiCu_4 with D1a type superlattice of TiCu_4 and B2 type superlattice of TiCu. The surface of pure Cu treated with titanizing was strengthened remarkably.

关 键 词：纯铜 双层辉光放电 渗钛处理 双层辉光离子渗金属技术 扫描电子显微镜 X射线衍射仪 

分 类 号：TG174.4[金属学及工艺—金属表面处理]