Cu单晶体驻留滑移带的形成与消失  

FORMATION AND ANNIHILATION OF PERSISTENT SLIP BANDS IN FATIGUED COPPER SINGLE CRYSTALS

作　　者：朱荣[1] 李守新[1] 李勇[1] 李明扬[1] 晁月盛[2] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室,沈阳110016 [2]东北大学材料物理系,沈阳110004

出　　处：《金属学报》2004年第5期467-470,共4页Acta Metallurgica Sinica

基　　金：国家自然科学基金 50271075;国家重点基础研究发展规划项目 G19990650

摘　　要：在循环加载条件下,单滑移取向的Cu单晶体首先出现驻留滑移线(PSL),然后随着循环周次的增加转变为驻留滑移带(PSB),在不同温度、不同时间条件下对疲劳Cu单晶进行真空退火处理,观察PSB结构在热激活条件下的变化情况,结果表明,退火处理过程中由于空位浓度差异所产生的渗透力促使位错运动,并使PSB的某些部位逐步细化,以至消失,实现了PSB的分段相消,在退火过程中由于应变能的逐步释放,未观察到再结晶现象。In single-slip-oriented copper single crystals which were cyclically deformed under constant plastic shear strain amplitude control, the persistent slip line (PSL) was first formed in the vein dislocation structure of matrix, and then it was rather quickly transformed into persistent slip band (PSB) under consecutive cycling. During annealing for the fatigued copper single crystals with PSBs the penetrating force caused by different void densities drives dislocations motion, makes some parts of PSB thinning and finally PSBs disappeared under the mechanism of annihilation part by part. Because of gradual releasing of the strain energy in annealing process, no recrystallized grain has been observed.

关 键 词：Cu单晶体 驻留滑移线 驻留滑移带 渗透力 分段相消 

分 类 号：TG111.8[金属学及工艺—物理冶金] TG113.25[金属学及工艺—金属学]