热激励谐振式硅微结构压力传感器  

The Thermally Excited Resonant Silicon Micro Structural Pressure Sensor

作　　者：樊尚春[1] 

机构地区：[1]北京航空航天大学仪器学院测控与信息技术系,北京100083

出　　处：《科学技术与工程》2004年第5期426-429,共4页Science Technology and Engineering

基　　金：国家自然科学基金 ( 5 0 2 75 0 0 9);航空科学基金 ( 0 2I5 10 18)资助

摘　　要：针对一种以矩形硅膜片为一次敏感元件、硅梁谐振子为二次敏感元件采用电阻热激励、压敏电阻拾振的谐振式压力微传感器 ,简述了其工作机理 ;从谐振式硅微传感器整体优化设计、闭环系统优化设计、微弱信号检测、敏感元件工艺实践。Based on the actual structural feature of a novel resonant micro pressure sensor, whose preliminary sensing component is a rectangle diaphragm and the final sensing component is a beam resonator. The exciter is a thermal resistor and detector is piezoresistive unit for the resonant micro sensor. The operating principle of the sensor is introduced briefly and some recent results investigated are presented, such as optimizing the parameters of the whole sensing structure and the closed loop system of the micro sensor, inspecting the weak signal, manufacturing technology of the sensing component, testing the open loop performance of the micro sensor.

关 键 词：热激励 谐振式硅微结构 压力传感器 谐振式传感器 优化设计 闭环系统 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]