埋入电容基板技术  

The Technology of Embedded Capacitor Substrates

作　　者：蔡积庆 

出　　处：《印制电路信息》2004年第5期49-53,共5页Printed Circuit Information

摘　　要：概述了埋入电容树脂基板的高频特性和埋入电容树脂基板的制造例,可以获得20PF/mm^2的电容密度。与表面安装部件相比,埋入电容具有优良的电性能和安装占有面积小的优越性。This paper describes the high freqency characteristic of embedded capacitor resin substrates and the manafactruing example of embedded capOacitor resin substrates, can provide capacitance density of 20PF/mm^2.Ascompared with to surface mounting device (SMD), embeddedcapacitor have excellent eletronic properties and the advantage of mounting occupied area.

关 键 词：埋入电容基板 高频特性 电容密度 树脂基板 

分 类 号：TN405[电子电信—微电子学与固体电子学]