铜在甲胺铁氰化钾化学机械抛光液中的腐蚀与钝化  

Corrosion and passivation of copper in the CMP slurry of CH_3NH_2-K_3[Fe(CN)_6]

作　　者：何捍卫[1] 胡岳华[2] 周科朝[1] 熊翔[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,湖南长沙410083 [2]中南大学资源加工与生物工程学院,湖南长沙410083

出　　处：《功能材料》2004年第3期392-394,共3页Journal of Functional Materials

基　　金：国家杰出青年科学基金资助项目(59925412)

摘　　要：　用电化学测试技术研究了腐蚀介质和成膜剂浓度对铜表面的腐蚀与钝化成膜的影响,分析了钝化膜的成分,探讨了钝化膜在抛光压力和转速作用下的磨损与表面再钝化的行为,测量了铜在化学机械抛光过程中的极化曲线。结果表明铜在甲胺溶液介质铁氰化钾抛光液中易钝化,钝化膜的主要成分为Cu4[Fe(CN)6],有少量Cu2O存在。钝化膜的磨损特性随成分浓度不同而不同。钝化膜的磨损难易程度与钝化膜的本身特性、抛光压力及转速有关。抛光过程中因钝化膜被磨损,腐蚀加快,腐蚀电流密度大幅增加。配方0.1%甲胺溶液+0.5%K3Fe(CN)6+5%Al2O3可行。The influences of the corrosive medium and passivator concentration on the corrosion and passivation of copper in the chemical mechanical polishing (CMP) slurry of CH3NH2-K3 [Fe(CN)6] were studied by electrochemical measurement technology. The components of the passive films were analyzed by XPS. The behavior of abrasion, which was performed with polishing pressure and rotational velocity, and repassivation on the surface of copper was investigated. The polarization curves of copper during chemical mechanical polishing were measured. The results indicate that copper is passivated very easily in the methylamine aqueous medium with K3Fe(CN)6, and the main components of the passive films are Cu4[Fe(CN)6] and a little Cu2O. The abrasion characteristics of films vary with the component concentration. Whether difficult or easy the passive films are abraded, depending on the properties of the films, the polishing pressure and the rotational velocity. Because of the films are abraded during polishing, the corrosion rate is quickened and the corrosion current density is increased greatly. The slurry of 0.1% methylamine aqueous solution +0.5%K3Fe(CN)6+5%Al3O3 is feasible.

关 键 词：铜 化学机械抛光液 腐蚀与钝化 

分 类 号：O69[理学—化学] O646.6