纯铜双层辉光离子渗钛高温氧化性能的研究  

HIGH TEMPERATURE OXIDATION RESISTANCE OF THE PLASMA TITANIZING ON COPPER SURFACE BY DOUBLE GLOW DISCHARGE

作　　者：张跃飞[1] 袁庆龙[2] 陈飞[3] 苏永安[2] 徐重[2] 

机构地区：[1]北京印刷学院等离子体物理及材料实验室,北京102600 [2]太原理工大学表面工程研究所,太原030024 [3]北京石油化工学院机械工程系,北京102600

出　　处：《中国腐蚀与防护学报》2004年第3期139-142,共4页Journal of Chinese Society For Corrosion and Protection

摘　　要：采用双层辉光离子渗金属技术 ,在纯铜表面形成均匀的渗钛层 .对离子渗钛试样和纯铜试样在 4 0 0℃和70 0℃进行了高温氧化对比实验 ,分别给出了它们的氧化动力学曲线 ,用扫描电子显微镜观察分析氧化表面形貌 ,结果表明纯铜表面离子渗钛后提高了高温抗氧化的性能 ,降低了氧化速率 ,离子渗钛层的氧化膜致密 ,对继续氧化有阻碍作用 .Double glow discharge is applied to pure copper substrate to obtain titanizing alloying layer.The high temperature oxidation resistance of the plasma titanizing samples at 400℃ and 700℃ was investigated.The oxidation kinetics curve was worked out.The morphologies of oxidation surface were observed and analyzed with a scanning electron microscope and the oxidation mechanism was discussed.The results show that plasma titanizing on copper surface can improve greatly the high temperature oxidation resistance of copper.The oxidation rate of copper is less than that of plasma titanizing.The oxidation film of plasma titanizing sample is very dense and is not easily exfoliated.The dense oxidation film prevents the copper from more oxidation.

关 键 词：离子渗钛 纯铜 高温氧化性能 

分 类 号：TG172.82[金属学及工艺—金属表面处理]