选择性螯合滴定法测定镀铜-锌合金溶液中的铜和锌  

Determination of Cu and Zn Concentration in Cu-Zn Alloy Plating Solution by Selective Chelatometry

作　　者：王献科 李玉萍 

机构地区：[1]兰州钢厂,730020

出　　处：《材料保护》1993年第9期24-25,共2页Materials Protection

摘　　要：报道了测定镀铜-锌合金溶液中的铜、锌的一种简易、快速螯合滴定法。方法是用ED-TA螯舍铜(Ⅱ)、锌(Ⅱ)和其它金属离子,然后分别用巯基乙酸(TGA)和邻菲罗啉(phen)解蔽。研究了在测定铜、锌时一般共存离子的干扰。此法已被用于镀铜-锌合金溶液中的铜、锌的测定。A simple chelatometry method for the determination of Cu and Zn in Cu-Zn alloy plating solution is presented. It is based on the initial chelation of Cu ( Ⅱ ) and Zn ( Ⅱ) with EDTA and its subsequent decomposition with phen and thioglycollic acid. Interference of ions normally encountered in determination was also studied.

关 键 词：螯合滴定 铜 锌 铜锌合金 镀液 

分 类 号：TQ153.2[化学工程—电化学工业]