化学复合镀Ni-P-MoS_2工艺的试验研究  

Technological investigation of Ni-P-MoS_2 electroless composite plating

作　　者：徐方超[1] 胡三媛[1] 李长林[1] 张淑艳[1] 

机构地区：[1]中国农业大学工学院,北京100083

出　　处：《中国农业大学学报》2004年第3期49-52,共4页Journal of China Agricultural University

摘　　要：为了优化复合镀Ni P MoS2 镀液配方和工艺参数 ,获得质量优良并具有减磨、自润滑特性的镀层 ,以化学镀Ni P工艺为基础 ,进行了化学复合镀Ni P MoS2 工艺的试验研究。确定了MoS2 加入量、表面活性剂类型及其用量与镀速、镀层中MoS2 粒子含量的关系 ,以及温度、pH和搅拌方式对复合镀工艺的影响。提出了一种优化化学复合镀Ni P MoS2 工艺 ,即十六烷基三甲基溴化铵 4 5mg·L-1,壬基酚聚氧乙烯醚 1 5mL·L-1,镀液中MoS2 粒子(d =1～ 7μm)质量浓度 ρ(MoS2 ) 12 g·L-1,镀液 pH 4 4 ,施镀温度 84℃ ,间歇搅拌。验证试验结果表明 ,镀液性能稳定 ,镀层外观光滑平整 ,镀层内MoS2 粒子分布较均匀 ,镀速v最高可达 12 μm·h-1,镀层中MoS2 粒子体积分数φ最高可达 11% ;To optimize the Ni-P electroless plating technology, the electroless Ni P MoS 2 composite plating was investigated. The effects of the technique parameters such as the MoS 2 concentration, surfactants and its concentration, the temperature effects, the pH values, the agitation effects on the deposition rate and the volume percentage of MoS 2 in the deposit were considered and tested. The optimized Ni P MoS 2 electroless plating technology was presented. The CTAB was 45?mg·L -1 and NPE was 1 5?mL·L -1 . The concentration of the MoS 2 particle is 12?g·L -1 ,pH value is 4 4,the temperature of the electroless plating is 84?℃, agitate discontinuously. The results showed that a stable and homogeneous deposit with high quality was obtained. The distribution of the particles in the plating layer was pretty uniform, the maximum plating speed v was 12?μm·h -1 . The highest percentage φ of the MoS 2 particles in the plating layer was 11 % . This new technology can be used successfully in the production.

关 键 词：化学复合镀 Ni-P-MoS2 表面活性剂 

分 类 号：TB333[一般工业技术—材料科学与工程]