一种高密度电子模块的热设计  

Thermal Design of a High Density Electronic Module

作　　者：田沣[1] 任康[1] 焦超锋[1] 南雁[1] 

机构地区：[1]中国航空计算技术研究所,陕西西安710068

出　　处：《航空计算技术》2004年第1期116-118,共3页Aeronautical Computing Technique

摘　　要：随着工业档表贴器件在机载电子设备中日益广泛的使用,模块的热设计成为影响产品性能的关键技术。对一种高密度电子模块的热设计进行了研究,简要分析了影响散热效果的几种因素,提出了采用顶部导热板散热的新型结构,经过热性能测试和试飞验证,可以满足系统的热设计要求。With the SMD components were being widely used in electronics equipments, the thermal design of the module is becoming the key technique which influences the product's performance. By doing a thermal design research of a high density electronic module, this paper formulates the factors which influence the effect of heat dissipation. At the same time, a new kind of heat conduction board which dissipates heat from top side of the components is being brought forward. Passing through the thermal performance test and flight test, this structure is certificated can be met the system's thermal design demand.

关 键 词：机载电子设备 热设计 信号处理板 冷却介质 

分 类 号：V243[航空宇航科学与技术—飞行器设计]