微量钛调控金刚石/铜复合材料界面及热性能  

Enhancing the Interface Bonds and Thermal Properties of Diamond/Copper Composites via Micro-Titanium

作　　者：车飞妮 张树康 车清论 张建军 王进 徐洋 

机构地区：[1]青岛理工大学,机械与汽车工程学院,山东青岛

出　　处：《材料科学》2018年第12期1135-1145,共11页Material Sciences

基　　金：山东省自然基金资助(资助号:ZR2017QF010).

摘　　要：考察了钛元素加入到金刚石颗粒与铜基体中能够改善金刚石/铜复合材料之间的界面结合。在烧结过程中对金刚石和钛元素的体积分数进行了优化,钛元素对复合材料的微观结构、热性能和界面结合的影响进行了研究。该结果表明,通过改变钛和金刚石的体积分数改善了复合材料的界面粘结性。在45 vol.%-金刚石/铜复合材料中加入3 vol.%钛制备的复合材料的热导率高达670 W/(m?K),温度为1080?C,保温时间为5 h,其热导率达到了理论预测值的90%。这是因为在铜/金刚石界面处形成碳化钛(TiC)和金属间化合物(Cu3Ti2)获得良好的界面粘结性,从而实现了高的热导率。同时,液态金属填充金刚石之间的孔隙进行了表面张力动力学计算。The addition of titanium element into Copper matrix for the alloying was confirmed to improve the interface bonds of Copper and diamond composites. In the sintering processing the effect of the optimized fraction volume of diamond and titanium elements on microstructure, thermal and interface bond of the composites was investigated. The study results indicate that the interface adhesion force of the composites is extremely improved by controlling the fraction volume of di-amond and titanium. The thermal conductivity of fabricated diamond/copper composites with the 3 vol.% titanium elements reaches 670 W/(m?K) at 1080?C for 5 h, achieving the predicted value of 90% due to the formation of TiC and Cu3Ti2 on the diamond/copper interface obtaining the better interfacial bonding to make the composites attain the higher thermal conductivities. In addition, the surface stress dynamics of the gaps between diamonds filled with liquid metal at high temperatures is calculated in this study.

关 键 词：导热率 金刚石 放电等离子烧结 复合材料 

分 类 号：TB3[一般工业技术—材料科学与工程]