铜掺杂氧化锌微米棒灭菌特性研究  

Sterilization Characteristics of Cu Doped ZnO Microrods

作　　者：潘惊明 王丽娜 

机构地区：[1]大连海洋大学海洋科技与环境学院,辽宁 大连

出　　处：《材料科学》2021年第9期1028-1035,共8页Material Sciences

摘　　要：本文主要利用化学气相沉积(CVD)法制备氧化锌微米棒并对样品进行铜(Cu)掺杂。研究Cu掺杂对氧化锌微米棒灭菌特性影响。结果表明,Cu掺杂有效地改变了样品的表面形貌。进一步研究表明,Cu掺杂后样品灭菌性能显著提高。我们分别采用大肠杆菌,金黄色葡萄球菌,枯草芽孢杆菌和蜡样芽孢杆菌为试验菌株进行了灭菌实验。实验结果表面,针对四种菌株,氧化锌微米棒灭菌率分别为60.42%、73.67%、95.34%、99.19%;铜掺杂后对四种菌落的灭菌特性分别为70.33%、88.93%、98.51%、99.81%,Cu掺杂后其灭菌率分别提高了9.91%,15.26%,3.17%,0.62%。In this paper, ZnO micro rods were prepared by chemical vapor deposition (CVD) and doped with copper (Cu). The effect of Cu doping on the sterilization characteristics of ZnO micro rods was studied. The results show that Cu doping effectively changes the surface morphology of the samples. Further research shows that the sterilization performance of Cu doped samples is significantly improved. We used Escherichia coli, Staphylococcus aureus, Bacillus subtilis and Bacillus cereus as test strains for sterilization experiments. The results showed that the sterilization rates of ZnO Microrods were 60.42%, 73.67%, 95.34%, 99.19%, and the sterilization rates of Cu doped ZnO Microrods were 70.33%, 88.93%, 98.51%, 99.81%, after Cu doped the sterilization rates of the four strains were increased by 9.91%, 15.26%, 3.17% and 0.62% respectively.

关 键 词：氧化锌 微米棒 灭菌特性 铜掺杂 

分 类 号：TB3[一般工业技术—材料科学与工程]