硅绒面上电镀铜工艺对铜层的电学性能与均匀性的影响  

Effect of Preparation Technology on Electrical Properties and Uniformity of Electroplating Copper Layer on Silicon Texture

作　　者：李同彩[1] 郭宝刚 李同洪 王建新 霍冀川 刘德雄[1] 

机构地区：[1]西南科技大学数理学院,四川 绵阳 [2]西南科技大学分析测试中心,四川 绵阳 [3]国家金刚石工具质量检验检测中心(湖北),湖北 鄂州

出　　处：《材料科学》2023年第11期977-983,共7页Material Sciences

摘　　要：为降低硅基太阳能电池的制造成本,提高其光电转换效率,采用电沉积的方法在硅绒面上制备铜金属层。通过调整电镀电流、阴阳极面积比和间距等参数,研究不同制备工艺对电极电阻率、表面形貌、相结构和厚度均匀性的影响。实验结果表明,电镀电流密度的大小对电镀铜层的表面形貌和相结构有显著影响,进而影响电阻率的大小。当电流密度为2.4 A/dm2时,电镀铜层的电阻率最低,表面致密光亮,且具有(111)的择优取向。铜镀层的厚度的均匀性受电镀阳极和阴极的面积比以及两者的间距的控制。当阳极与阴极面积比为3:1,间距为8 cm时,所得镀层的厚度均匀性最好。In order to reduce the manufacturing cost of silicon-based solar cells and improve their photoelectric conversion efficiency, copper metal layer was prepared on silicon texture surface by electrodeposition method. The effects of different preparation processes on electrode resistivity, surface morphology, phase structure and thickness uniformity were studied by adjusting electroplating current, anode and cathode area ratio and distance. The experimental results show that the electroplating current density has a significant effect on the surface morphology and phase structure of the electroplating copper layer, and then affects the resistivity. When the current density is 2.4 A/dm2, the electroplated copper layer has the lowest resistivity, dense and bright surface, and has a preferred orientation of (111). The thickness uniformity of copper coating is controlled by the area ratio of cathode and anode and the spacing between them. When the area ratio of anode to cathode is 3:1 and the spacing is 8 cm, the thickness uniformity of the coating is the best.

关 键 词：硅绒面 电镀 电阻率 厚度均匀性 

分 类 号：TQ1[化学工程]