高导热热解石墨与铝的低热阻界面连接技术  

Low Thermal Resistance Interface Connection Technology between High Thermal Conductivity Pyrolytic Graphite and Aluminum

作　　者：边燕飞 杨艳红[1] 王宇光 田峰 王若甫 卢立东[1] 易文清 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北 石家庄

出　　处：《材料科学》2024年第10期1509-1519,共11页Material Sciences

摘　　要：高导热热解石墨(Highly Thermal Conductivity Pyrolytic Graphite, HTPG)是一种导热系数约为1600 W/(m·K)的新型材料。可以利用HTPG的这种特性来开发高导热复合材料,用于需要有效热管理的设备。本文采用钎焊方法将HTPG包覆在铝中,并在5 W,10 W,15 W三种不同加热功率下对复合基板与纯铝件的热性能进行了对比。结果表明,高导热热解石墨–铝复合基板的热性能明显优于纯铝件,热扩散性能提高了约4倍。High Thermal Conductivity Pyrolytic Graphite (HTPG) is a new material with a thermal conductivity of about 1600 W/(m·K). This characteristic of HTPG can be used to develop high thermal conductivity composites for equipment requiring effective thermal management. In this paper, HTPG has been encapsulated in aluminum by brazing, and the thermal properties of composite substrate and pure aluminum were compared under three different heating power of 5 W, 10 W and 15 W. The results show that the thermal performance of high thermal conductivity pyrolytic graphite-aluminum composite substrate is obviously better than that of pure aluminum, and the thermal diffusivity is improved by about 4 times.

关 键 词：高导热热解石墨 铝 低热阻 基板 热性能 

分 类 号：TB3[一般工业技术—材料科学与工程]