Comparisons of Structured Surface Floors for Pool Boiling Enhancement at Low Heat Fluxes: Hands-On Learning Setup for Heat Transfer Classroom  

Comparisons of Structured Surface Floors for Pool Boiling Enhancement at Low Heat Fluxes: Hands-On Learning Setup for Heat Transfer Classroom

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作  者:Birce Dikici Basim Q. A. Al-Sukaini Birce Dikici;Basim Q. A. Al-Sukaini(Department of Mechanical Engineering, Embry-Riddle Aeronautical University (ERAU), Daytona Beach, FL, USA;Rumaila Operating Organization (ROO) HQ, Basra Oil Company (BOC) Rumaila, Basra, Iraq)

机构地区:[1]Department of Mechanical Engineering, Embry-Riddle Aeronautical University (ERAU), Daytona Beach, FL, USA [2]Rumaila Operating Organization (ROO) HQ, Basra Oil Company (BOC) Rumaila, Basra, Iraq

出  处:《World Journal of Engineering and Technology》2023年第2期303-318,共16页世界工程和技术(英文)

摘  要:Various enhanced surfaces have been proposed over the years to improve boiling heat transfer. This paper introduces an experimental setup designed for boiling demonstration in the graduate-level Heat Transfer course. The pool boiling performance of water under atmospheric pressure of 1.025 bar is investigated by using several structured surfaces at heat fluxes of 28 and 35 kW/m<sup>2</sup>. Surfaces with holes, rectangular grooves, and mushroom fins are manufactured by an NC-controlled vertical milling machine. The heat flux versus excess temperature graph is plotted by using thermocouple measurements of water and base temperatures of the boiling vessel. The separation, rise, and growth of individual vapor bubbles from the surface during boiling were recorded with a digital camera. The results for the plain surface are compared to the Rohsenow correlation. The enhancement of heat transfer coefficient (h) ranged between 15% - 44.5% for all structured surfaces. The highest heat transfer coefficient enhancement is observed between 41% - 56.5% for holed surface-3 (405 holes) compared to the plain surface. The excess temperature dropped around 29% - 34% for holed surface-3 (405 holes) compared to the plain surface. The heat transfer coefficient increases as the spacing between channels or holes decreases. While the bubbles on holed and mushroomed surfaces were spherical, the bubbles on the flat and grooved surfaces were observed as formless. The suggested economical test design could be appropriate to keep students focused and participating in the classroom.Various enhanced surfaces have been proposed over the years to improve boiling heat transfer. This paper introduces an experimental setup designed for boiling demonstration in the graduate-level Heat Transfer course. The pool boiling performance of water under atmospheric pressure of 1.025 bar is investigated by using several structured surfaces at heat fluxes of 28 and 35 kW/m<sup>2</sup>. Surfaces with holes, rectangular grooves, and mushroom fins are manufactured by an NC-controlled vertical milling machine. The heat flux versus excess temperature graph is plotted by using thermocouple measurements of water and base temperatures of the boiling vessel. The separation, rise, and growth of individual vapor bubbles from the surface during boiling were recorded with a digital camera. The results for the plain surface are compared to the Rohsenow correlation. The enhancement of heat transfer coefficient (h) ranged between 15% - 44.5% for all structured surfaces. The highest heat transfer coefficient enhancement is observed between 41% - 56.5% for holed surface-3 (405 holes) compared to the plain surface. The excess temperature dropped around 29% - 34% for holed surface-3 (405 holes) compared to the plain surface. The heat transfer coefficient increases as the spacing between channels or holes decreases. While the bubbles on holed and mushroomed surfaces were spherical, the bubbles on the flat and grooved surfaces were observed as formless. The suggested economical test design could be appropriate to keep students focused and participating in the classroom.

关 键 词:BOILING Pool Boiling Heat Transfer Coefficient Enhancement Techniques Engineering Education 

分 类 号:O35[理学—流体力学]

 

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