Joining of SiC Ceramics by the Flash-Bonding Technique  

作　　者：Takuro Yoshitake Yoshio Ohta Mikito Kitayama 

机构地区：[1]Department of Life Environment and Applied Chemistry, Fukuoka Institute of Technology, Fukuoka, Japan

出　　处：《Journal of Materials Science and Chemical Engineering》2020年第3期52-65,共14页材料科学与化学工程（英文）

摘　　要：Because Silicon carbide (SiC) ceramics have various excellent properties, the demand for larger and complicated shapes has been increasing. This paper introduces an innovative method that would not require a large furnace, and further, would minimize the production cost and the thermal history, namely the “flash-bonding” technique. The borosilicate glass with low thermal expansion coefficient, Pyrex glass, was selected as the brazing material. In this work, as-is or surface-oxidized SiC plates were joined using Pyrex glass as brazing material, and the reaction and wetting of Pyrex glass on as-is or surface-oxidized SiC plate were investigated. It was found that the protective film of the surface-oxidized SiC lowered the oxygen partial pressure, and hence, generated many pores in the interface.Because Silicon carbide (SiC) ceramics have various excellent properties, the demand for larger and complicated shapes has been increasing. This paper introduces an innovative method that would not require a large furnace, and further, would minimize the production cost and the thermal history, namely the “flash-bonding” technique. The borosilicate glass with low thermal expansion coefficient, Pyrex glass, was selected as the brazing material. In this work, as-is or surface-oxidized SiC plates were joined using Pyrex glass as brazing material, and the reaction and wetting of Pyrex glass on as-is or surface-oxidized SiC plate were investigated. It was found that the protective film of the surface-oxidized SiC lowered the oxygen partial pressure, and hence, generated many pores in the interface.

关 键 词：SILICON CARBIDE Joining Flash-Bonding BOROSILICATE GLASS 

分 类 号：TQ1[化学工程]